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High Stability Inertial Sensor MEMS Gyro Chip for OEM IMU Integration

Marchio:	Firepower
Numero di modello:	MGZ330HC-A1
MOQ:	1
prezzo:	Negoziabile
Condizioni di pagamento:	T/T
Capacità di approvvigionamento:	500/mese

Informazioni dettagliate

Descrizione del prodotto

Informazioni dettagliate

Luogo di origine:

Cina

Nome del prodotto:

PCB GYRO

Allineare:

100°/s

Larghezza della banda:

> 50 Hz

Stabilità del bias:

<0,02°/ora

Stabilità del bias (1σ 10s):

<0,1°/h

Stabilità del bias (1σ 1s):

0,3 °/h

Imballaggi particolari:

sponge+box

Capacità di alimentazione:

500/mese

Descrizione del prodotto

High Stability Inertial Sensor MEMS Gyro Chip for OEM IMU Integration

Our MEMS gyroscope chip delivers high-precision angular rate sensing for advanced inertial navigation and motion control applications. Designed with aerospace-level reliability and industrial-grade durability, it provides ultra-low noise, low bias instability, and excellent temperature stability for platforms that require long-term accuracy and robust performance.

Engineered for UAVs, autonomous robots, and industrial equipment, this MEMS gyro chip offers fast dynamic response, compact form factor, and low power consumption — making it ideal for embedded navigation systems and precision motion platforms.

PCB Design Guidelines

Decoupling capacitors for pins VCP, VREF, VBUF, and VREG should be placed as close to the pins as possible, with minimized trace equivalent resistance
Other ends of decoupling capacitors for VREF, VBUF, and VREG should connect to nearest AVSS_LN and then to signal ground via a magnetic bead
Decoupling capacitors for VCC and VIO must be placed close to corresponding pins
VCC operation requires about 35mA current — use wide PCB traces to ensure voltage stability
Avoid routing under the package for smooth assembly
Position components to avoid stress concentration areas, large heat dissipation elements, mechanical contact points, and warping-prone locations

Performance Specifications

Performance	Unit	MGZ332HC-P1	MGZ332HC-P5	MGZ318HC-A1	MGZ221HC-A4	MGZ330HC-O1	MGZ330HC-A1
Range	deg/s	400	400	400	400	400	100
Band Width @3DB customized	Hz	90	180	200	200	300	50
Output accuracy(digital SPI)	bits	24	24	24	24	24	24
Output rate(ODR)(customized)	Hz	12K	12K	12K	12K	12K	12K
Delay(customized)	ms	<3	<1.5	<1.5	<1.5	<1	<6
Bias stability	deg/hr(1o)	<0.05	<0.05	<0.1	<0.5	<0.1	<0.02
Bias stability (1σ 10s)	deg/hr(1o)	<0.5	<0.5	<1	<5	<1	<0.1
Bias stability (1σ 1s)	deg/hr(1o)	<1.5	<1.5	<3	<15	<3	<0.3
Bias error over temperature (1σ)	deg/hr(1o)	<5	<5	<10	<30	10	5
Bias temperature variations, calibrated(1σ)	deg/hr(1o)	<0.5	<0.5	<1	<10	<1	<0.5
Bias repeatability	deg/hr(1o)	<0.5	<0.5	<0.5	<3	<0.3	<0.1
Scale factor at 25°C	lsb/deg/s	20000	20000	16000	16000	20000	80000
Scale factor repeatability (1σ)	ppm(1o)	<20ppm	<20ppm	<20ppm	<20ppm	<100ppm	<100ppm
Scale factor vs temperature (1σ)	ppm(1o)	100ppm	100ppm	<100ppm	<100ppm	<300ppm	<300ppm
Scale factor non-linearity (1σ)	ppm	100ppm	100ppm	<150ppm	<150ppm	<300ppm	<300ppm
Angular random walk(ARW)	°/√h	<0.025	<0.025	<0.05	<0.25	<0.05	<0.005
Noise(Peak to Peak)	deg/s	<0.15	<0.3	<0.35	<0.4	<0.25	<0.015
GValue sensitivity	°/hr/g	<1	<1	<1	<3	<1	<1
Vibration rectification error(12gRMS,20-2000)	°/hr/g(rms)	<1	<1	<1	<3	<1	<1
Power-on time (valid data)	s	750m
Sensor Resonant Frequency	hz	10.5k-13.5K

Environmental Specifications

Impact (power on): 500g, 1ms
Impact resistance (power off): 10000g, 10ms
Vibration (power on): 18g rms (20Hz to 2kHz)
Working temperature: -40℃ to +85℃
Store temperature: -55℃ to +125℃
Supply voltage: 5±0.25V
Current consumption: 45mA

Installation Guidelines

This high-performance MEMS gyroscope is precision equipment. For optimal performance, consider these installation recommendations:

Evaluate sensor placement using thermal analysis, bending measurement, and finite element simulation
Perform drop tests after soldering to verify impact robustness
Maintain distance from stress concentration points:
- Use PCB thickness of 1.6-2.0mm to minimize inherent stress
- Avoid placement near buttons or mechanical stress points
- Keep away from heat sources like controllers or graphics chips

Tag:

Sensore della girobussola dell'accelerometro

Girobussola dell'accelerometro di IMU

Accelerometro di flessione del quarzo

girobussola a fibra ottica

Sistema di navigazione inerziale

Cercatore del nord della girobussola

Sensore del magnetometro

Sensore della girobussola dell'accelerometro

Girobussola dell'accelerometro di IMU

Accelerometro di flessione del quarzo

girobussola a fibra ottica

Sistema di navigazione inerziale

Cercatore del nord della girobussola

Sensore del magnetometro

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